(as of Feb 13, 2024 22:53:00 UTC – Details)
<
This high power module is a general add-on heated bed power expansion module for 3D printer. With this add on module to your 3D printer motherboard, the maximum current up to 25A.
Heat bed high power expansion module, solve the problem of excessive power and current load due to hot bed, and can well protect the connectors on the controller board from overheating.
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle. Under the premise of normal cooling, it work stable under I(Max)=25A.
The best connection is made of new materials, stainless steel and the high grade aluminum blocks, which give longer product life.
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this).
